MIL-PRF-85726B(AS)
3.4 Performance requirements.
3.4.1 High temperature. Structural and electrical integrity shall be maintained for
temperatures up to 95 °C (203 °F) for prolonged periods of time. The enclosure shall not bind,
crack, discolor, or bulge, and the gasket shall not lose its resiliency, or become permanently
distorted when tested as specified in 4.5.2.1.
3.4.2 Low temperature. The enclosure shall withstand temperatures down to -55 °C
(-67 °F). The enclosure shall maintain structural and electrical integrity during exposure to such
temperatures. The enclosure shall not bind, crack, discolor or bulge, and the gasket shall not lose
its resiliency, or become permanently distorted when tested as specified in 4.5.2.2.
3.4.3 Temperature shock. The enclosure shall pass the temperature shock test specified in
4.5.2.3 with no physical or performance degradations.
3.4.4 Humidity. The enclosure shall maintain structural and electrical integrity when tested
as specified in 4.5.2.4. There shall be no resulting evidence of swelling, absorption of water,
change of mechanical properties, corrosion, or other forms of deterioration.
3.4.5 Fungus. Enclosures covered by this specification shall be constructed of materials
which are not nutrients to fungus. The enclosure shall pass the test of 4.5.2.5 without any
degradation of performance (see 6.4).
3.4.6 Salt fog. The enclosure shall pass the salt fog test specified in 4.5.2.6 with no
corrosion, deterioration, or performance degradation.
3.4.7 Acceleration. The enclosure shall pass the acceleration test specified in 4.5.2.7 with
no material yield, failure, or loss of joint integrity.
3.4.8 Vibration. The enclosure shall withstand the vibration levels of internally mounted
equipment on jet aircraft, helicopters, and propeller driven aircraft. The enclosure shall maintain
structural and mechanical rigidity and electrical connectivity when tested as specified in 4.5.2.8.
There shall be no resulting material yield, failure, or loss of joint integrity.
3.4.9 Shock. The enclosure shall withstand the physical shock of equipment mounted
internally to aircraft making carrier landings. The enclosure shall maintain structural and
mechanical rigidity, and electrical connectivity when tested as specified in 4.5.2.9. There shall
be no material yield, failure, or loss of joint integrity.
3.4.10 Crash safety. The enclosure shall maintain structural and mechanical rigidity and
electrical connectivity when tested as specified in 4.5.2.10.
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